Sr/shift engineer - semiconductor advanced packaging (hbm integration)
Company: Micron
Location: San Jose
Posted on: April 18, 2024
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Job Description:
Our vision is to transform how the world uses information to
enrich life for all.Micron Technology is a world leader in
innovating memory and storage solutions that accelerate the
transformation of information into intelligence, inspiring the
world to learn, communicate and advance faster than ever.Job
Description : The Shift Engineers will be responsible for
overseeing the operation, maintenance, and optimization of
semiconductor advanced packaging processes, with a specific focus
on HBM integration AND/OR across CMP, WET, ETCH, PHOTO, CVD,
bonding, debonding, TCD, wafer preparation, hybrid bonding, pre-
and post-encapsulation, and other relevant processes.These roles
will be crucial for ensuring the smooth and efficient operation of
the pilot line during multiple shifts.Job Responsibilities : -
Process Operation : Monitor and control semiconductor packaging
processes across various equipment and tools, ensuring adherence to
specifications and quality standards.- Equipment Maintenance :
Perform routine maintenance tasks, troubleshoot equipment issues,
and coordinate with maintenance technicians to minimize downtime
and maximize equipment uptime.- Process Optimization : Collaborate
with process engineers to optimize semiconductor packaging
processes for improved yield, reliability, and performance.-
Quality Assurance : Conduct regular inspections and quality checks
to ensure the reliability and performance of HBM-integrated
semiconductor packages.- Shift Coordination : Coordinate with other
shift engineers, operators, and technicians to ensure smooth
handovers and continuity of operations between shifts.-
Documentation and Reporting : Maintain detailed logs of process
parameters, equipment status, and production activities.Generate
shift reports and communicate any issues or concerns to the
appropriate stakeholders.- Safety and Compliance : Adhere to all
safety protocols, regulatory requirements, and company policies to
maintain a safe and compliant work environment.- Training and
Development : Train and mentor new operators and technicians on
semiconductor packaging processes, equipment operation, and safety
procedures.Qualifications : - Education : Bachelor's degree in
Electrical Engineering, Materials Science, Chemical Engineering,
Science or related field.- Experience : Minimum of 2-3 years of
experience in semiconductor manufacturing or a related field, with
hands-on experience in semiconductor packaging or Frontend
processes.Experience with HBM integration is a plus.- Technical
Skills : Proficiency in operating semiconductor packaging or
frontend equipment such as CMP, WET, ETCH, PHOTO, CVD, bonding,
debonding, TCD, wafer preparation, hybrid bonding, and
encapsulation tools.- Problem-Solving Abilities : Strong analytical
and problem-solving skills, with the ability to troubleshoot
equipment issues and optimize process parameters.- Communication
Skills: Effective verbal and written communication skills, with the
ability to communicate clearly and professionally with team members
and stakeholders.- Adaptability : Ability to work effectively in a
fast-paced and dynamic environment, with the flexibility to work
rotating shifts or Day/Night as required.- Team Player :
Collaborative mindset with a willingness to work closely with
cross-functional teams to achieve common goals.The US base salary
range that Micron Technology estimates it could pay for this
full-time position is: $127,000.00 - $216,000.00 Our salary ranges
are determined by role, level, and location. The range displayed on
each job posting reflects the minimum and maximum target for new
hire salaries of the position across all US locations. Within the
range, individual pay is determined by work location and additional
job-related factors, including knowledge, skills, experience,
tenure and relevant education or training. The pay scale is subject
to change depending on business needs. Your recruiter can share
more about the specific salary range for your preferred location
during the hiring process.Additional compensation may include
benefits, discretionary bonuses and equity.As a world leader in the
semiconductor industry, Micron is dedicated to your personal
wellbeing and professional growth.Micron benefits are designed to
help you stay well, provide peace of mind and help you prepare for
the future.We offer a choice of medical, dental and vision plans in
all locations enabling team members to select the plans that best
meet their family healthcare needs and budget. Micron also provides
benefit programs that help protect your income if you are unable to
work due to illness or injury, and paid family leave.Additionally,
Micron benefits include a robust paid time-off program and paid
holidays.For additional information regarding the Benefit programs
available, please see the Benefits Guide posted on
micron.com/careers/benefits.Micron is proud to be an equal
opportunity workplace and is an affirmative action employer.All
qualified applicants will receive consideration for employment
without regard to race, color, religion, sex, sexual orientation,
age, national origin, citizenship status, disability, protected
veteran status, gender identity or any other factor protected by
applicable federal, state, or local laws.To learn about your right
to work click here.To learn more about Micron, please visit
micron.com/careers US Sites Only: To request assistance with the
application process and/or for reasonable accommodations, please
contact Micron's People Organization at hrsupport_na@micron.com or
1-800-336-8918 (select option #3) Micron Prohibits the use of child
labor and complies with all applicable laws, rules, regulations,
and other international and industry labor standards.Micron does
not charge candidates any recruitment fees or unlawfully collect
any other payment from candidates as consideration for their
employment with Micron.
Keywords: Micron, San Jose , Sr/shift engineer - semiconductor advanced packaging (hbm integration), Engineering , San Jose, California
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